Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703396 | Plastic encapsulated semiconductor device having wing leads | — | 1997-12-30 |
| 5623162 | Lead frame having cut-out wing leads | — | 1997-04-22 |
| 5048179 | IC chip mounting method | Masahiro Shindo, Toshikazu Yoshimizu, Shunpei Tamaki, Toshio Kawakami, Yukio Kadowaki +1 more | 1991-09-17 |
| 4938923 | Gold wire for the bonding of a semiconductor device | Takeshi Kujiraoka, Koichiro Mukoyama, Hiromi Yamamoto | 1990-07-03 |
| 4890151 | Thin-film and its forming method | Masahiro Kameda, Yojiro KAMEI | 1989-12-26 |