| 9936918 |
Insulation of micro structures |
Edvard Kalvesten, Anders Olof Eriksson |
2018-04-10 |
| 9718674 |
Thin capping for MEMS devices |
Edvard Kalvesten, Niklas Svedin |
2017-08-01 |
| 9620390 |
Method of making a semiconductor device having a functional capping |
Edvard Kalvesten, Tomas Bauer |
2017-04-11 |
| 9613863 |
Method for forming electroless metal through via |
Henrik Knutsson |
2017-04-04 |
| 9514985 |
Electroless metal through silicon via |
Henrik Knutsson |
2016-12-06 |
| 9511999 |
Thin film capping |
Niklas Svedin |
2016-12-06 |
| 9484293 |
Semiconductor devices with close-packed via structures having in-plane routing and method of making same |
Daniel Perttu |
2016-11-01 |
| 9448401 |
Via structure and method thereof |
Edvard Kalvesten, Peter Agren, Niklas Svedin |
2016-09-20 |
| 9362139 |
Method of making a semiconductor device having a functional capping |
Edvard Kalvesten, Tomas Bauer |
2016-06-07 |
| 9355895 |
Method of providing a via hole and routing structure |
Daniel Perttu |
2016-05-31 |
| 9312217 |
Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections |
Edvard Kalvesten, Tomas Bauer |
2016-04-12 |
| 9240373 |
Semiconductor devices with close-packed via structures having in-plane routing and method of making same |
Daniel Perttu |
2016-01-19 |
| 9224681 |
CTE matched interposer and method of making |
Daniel Perttu |
2015-12-29 |
| 8866289 |
Bonding process and bonded structures |
Edward Kalvesten, Niklas Svedin, Anders Olof Eriksson |
2014-10-21 |
| 8729685 |
Bonding process and bonded structures |
Edward Kalvesten, Niklas Svedin, Anders Olof Eriksson |
2014-05-20 |
| 8729713 |
Via structure and method thereof |
Edvard Kalvesten, Peter Agren, Niklas Svedin |
2014-05-20 |
| 8637351 |
Methods for making micro needles and applications thereof |
Edvard Kalvesten, Thierry Corman |
2014-01-28 |
| 8630033 |
Via structure and method thereof |
Edvard Kalvesten, Peter Agren, Niklas Svedin, Thomas Ericson |
2014-01-14 |
| 8598676 |
Barrier structure |
Tomas Bauer |
2013-12-03 |
| 8592981 |
Via structure and method thereof |
Edvard Kalvesten, Peter Agren, Niklas Svedin |
2013-11-26 |
| 8485416 |
Bonding process and bonded structures |
Edward Kalvesten, Niklas Svedin, Anders Olof Eriksson |
2013-07-16 |
| 8308960 |
Methods for making micro needles and applications thereof |
Edvard Kalvesten, Thierry Corman |
2012-11-13 |
| 7560802 |
Electrical connections in substrates |
Edvard Kalvesten, Niklas Svedin, Pelle Rangsten, Tommy Schönberg |
2009-07-14 |
| 7172911 |
Deflectable microstructure and method of manufacturing the same through bonding of wafers |
Edvard Kalvesten, Niklas Svedin, H{dot over (a)}kan Westin |
2007-02-06 |