Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243773 | Liner and barrier layer in dual damascene cu interconnect for enhanced EM and process | Zhaosheng Meng, Min-hwa Chi | 2025-03-04 |
| 11834754 | ALD method with multi-chambers for sic or multi-elements epitaxial growth | Zhaosheng Meng, Min-hwa Chi | 2023-12-05 |