Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243773 | Liner and barrier layer in dual damascene cu interconnect for enhanced EM and process | Zhuangzhuang Wu, Min-hwa Chi | 2025-03-04 |
| 12131946 | Method to form contacts with multiple depth by enhanced CESL | Min-hwa Chi, Xian Zhang | 2024-10-29 |
| 11978702 | Simultaneous self-forming hea barrier and Cu seeding layers for Cu interconnect | Yong Zhao, Min-hwa Chi | 2024-05-07 |
| 11860650 | Method for monitoring and controlling supporting posture of supporting-type hydraulic support | Yunyue Xie, Shaoqi Zhang, Weikang Song, Maolin TIAN, Hongtian Xiao | 2024-01-02 |
| 11834754 | ALD method with multi-chambers for sic or multi-elements epitaxial growth | Zhuangzhuang Wu, Min-hwa Chi | 2023-12-05 |