Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7374652 | Plating method | Shinjiro Hayashi, Masaru Kusaka, Koichi Yomogida | 2008-05-20 |
| 6977035 | Method for electrolytic copper plating | Masaru Kusaka, Shinjiro Hayashi | 2005-12-20 |
| 6899781 | Method for forming resin composite material | Masaru Seita, Masaaki Imanari, Koichi Yomogida, Hidemi Nawafune | 2005-05-31 |
| 6881319 | Electrolytic copper plating solution and method for controlling the same | Masaru Seita, Shinjiro Hayashi | 2005-04-19 |
| 6835294 | Electrolytic copper plating method | Masaru Kusaka, Shinjiro Hayashi | 2004-12-28 |
| 6821556 | Process for producing heat sensitive recording material | Koichi Ishida, Kazuo Watanabe, Yutaka Isu | 2004-11-23 |
| 6761814 | Via filling method | Masaru Kusaka | 2004-07-13 |
| 6740425 | Method for manufacturing copper-resin composite material | Masaru Seita, Masaaki Imanari, Yoshihiro Sugita | 2004-05-25 |
| 5653779 | Method for manufacturing quartz glass components and molding frame therefor | Makoto Saito, Eiichi Shinomiya, Hiroyuki Kimura, Kimikazu Taniyama, Norikazu Fujii | 1997-08-05 |