Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6899781 | Method for forming resin composite material | Hideki Tsuchida, Masaaki Imanari, Koichi Yomogida, Hidemi Nawafune | 2005-05-31 |
| 6881319 | Electrolytic copper plating solution and method for controlling the same | Hideki Tsuchida, Shinjiro Hayashi | 2005-04-19 |
| 6740425 | Method for manufacturing copper-resin composite material | Hideki Tsuchida, Masaaki Imanari, Yoshihiro Sugita | 2004-05-25 |
| 5454930 | Electrolytic copper plating using a reducing agent | Takeshi Miura | 1995-10-03 |
| 5302256 | Immersion tin/lead alloy plating bath | Takeshi Miura, Shigeru Kodaira | 1994-04-12 |