Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7374652 | Plating method | Shinjiro Hayashi, Hideki Tsuchida, Koichi Yomogida | 2008-05-20 |
| 6977035 | Method for electrolytic copper plating | Hideki Tsuchida, Shinjiro Hayashi | 2005-12-20 |
| 6835294 | Electrolytic copper plating method | Hideki Tsuchida, Shinjiro Hayashi | 2004-12-28 |
| 6761814 | Via filling method | Hideki Tsuchida | 2004-07-13 |