Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6547902 | Die bonding method and apparatus | Tsuneharu Arai, Eiji Kikuchi | 2003-04-15 |
| 6003655 | Lead frame separating and conveying apparatus | Yuji Tanaka, Eiichi Shimazaki, Mitsuo Kosuda | 1999-12-21 |
| 5208464 | Device for detecting errors in top/bottom/front/back orientation of a lead frame | Masayuki Shimura | 1993-05-04 |