Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6547902 | Die bonding method and apparatus | Eiji Kikuchi, Michio Yonemoto | 2003-04-15 |
| 6062795 | Wafer ring feeding apparatus | Shigeru Fuke, Eiji Kikuchi | 2000-05-16 |
| 5853532 | Wafer ring supply and return device | Osamu Nakamura, Shigeru Ichikawa | 1998-12-29 |
| 5823418 | Die transporting device | Osamu Nakamura | 1998-10-20 |
| 5824185 | Wafer ring supply and return device | Osamu Nakamura, Shigeru Ichikawa | 1998-10-20 |
| 5725728 | Pellet pick-up device | Shigeru Fuke, Osamu Nakamura | 1998-03-10 |
| 5603446 | Bonding apparatus | Eiji Kikuchi | 1997-02-18 |