Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6244493 | Die bonding apparatus | Tsutomu Sugimoto, Toshihiro Naoi, Osamu Nakamura, Noboru Fujino | 2001-06-12 |
| 6003655 | Lead frame separating and conveying apparatus | Yuji Tanaka, Mitsuo Kosuda, Michio Yonemoto | 1999-12-21 |