KS

Kohei Seyama

SH Shinkawa: 42 patents #1 of 229Top 1%
TU Tohoku University: 1 patents #615 of 1,680Top 40%
Overall (All Time): #68,657 of 4,157,543Top 2%
43
Patents All Time

Issued Patents All Time

Showing 26–43 of 43 patents

Patent #TitleCo-InventorsDate
10350692 Heater for bonding apparatus and method of cooling the same Yasuhiro CHIDA, Osamu Kakutani 2019-07-16
10340163 Mounting apparatus 2019-07-02
10181451 Electronic component mounting apparatus Akira Sato 2019-01-15
10137519 Flux reservoir apparatus Shoji Wada 2018-11-27
9968020 Electronic-component mounting apparatus 2018-05-08
9576927 Bonding tool cooling apparatus and method for cooling bonding tool Osamu Kakutani, Takatoshi Kawamura, Akira Sato 2017-02-21
9536856 Flip chip bonder and flip chip bonding method 2017-01-03
9406640 Flip chip bonder and method of correcting flatness and deformation amount of bonding stage 2016-08-02
8800843 Bonding apparatus Nobuyuki Aoyagi 2014-08-12
8511534 Ultrasonic horn Osamu Kakutani, Yutaka Kondo 2013-08-20
8434656 Ultrasonic horn Osamu Kakutani, Yutaka Kondo 2013-05-07
8181527 Method and apparatus for pass/fail determination of bonding and bonding apparatus Nobuyuki Aoyagi 2012-05-22
8152043 Ultrasonic horn Osamu Kakutani, Yutaka Kondo 2012-04-10
8052026 Ultrasonic horn Osamu Kakutani, Yutaka Kondo 2011-11-08
7886956 Bonding apparatus and bonding stage height adjustment method for the bonding apparatus Yutaka Kondo, Osamu Kakutani, Shigeru Hayata 2011-02-15
7780056 Horn attachment arm 2010-08-24
7735707 Wire bonding apparatus 2010-06-15
7578421 Horn-holder pivot type bonding apparatus 2009-08-25