Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10293460 | Method of producing polishing head and polishing apparatus | Hiromasa Hashimoto, Masanao SASAKI, Takahiro Matsuda | 2019-05-21 |
| 7740521 | Polishing head, polishing apparatus and polishing method for semiconductor wafer | Hiromasa Hashimoto, Hisashi Masumura, Kouzi Kitagawa, Toshimasa Kubota, Takahiro Matsuda | 2010-06-22 |
| 6652356 | Wire saw and cutting method | — | 2003-11-25 |