Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10000629 | Resin composition whose lubricity under wet conditions is maintained | Hitoshi Ozawa, Yo Yamauchi | 2018-06-19 |
| 9622961 | Water-soluble polyalkylene oxide-modified product | Hitoshi Ozawa, Yusuke Nishikawa, Tsuyoshi Masuda | 2017-04-18 |
| 9574154 | Sheet whose lubricity is maintained under wet conditions | Hitoshi Ozawa, Yusuke Nishikawa | 2017-02-21 |
| 6234879 | Method and apparatus for wafer chamfer polishing | Fumihiko Hasegawa, Yasuyoshi Kuroda | 2001-05-22 |
| 5733181 | Apparatus for polishing the notch of a wafer | Fumihiko Hasegawa, Yasuyoshi Kuroda, Koichiro Ichikawa, Yasuo Inada | 1998-03-31 |
| 5727990 | Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus | Fumihiko Hasegawa, Yasuyoshi Kuroda, Koichiro Ichikawa, Yasuo Inada | 1998-03-17 |
| 5547415 | Method and apparatus for wafer chamfer polishing | Fumihiko Hasegawa, Yasuyoshi Kuroda | 1996-08-20 |
| 5538463 | Apparatus for bevelling wafer-edge | Fumihiko Hasegawa, Yasuyoshi Kuroda | 1996-07-23 |
| 5476413 | Apparatus for polishing the periphery portion of a wafer | Fumihiko Hasegawa, Yasuyoshi Kuroda, Koichiro Ichikawa, Yasuo Inada | 1995-12-19 |
| 5458529 | Apparatus for polishing notch portion of wafer | Fumihiko Hasegawa, Koichiro Ichikawa, Yoshio Nakamura | 1995-10-17 |
| 5429544 | Polishing apparatus for notch portion of wafer | Fumihiko Hasegawa, Koichiro Ichikawa, Yoshio Nakamura | 1995-07-04 |
| 5404678 | Wafer chamfer polishing apparatus with rotary circular dividing table | Fumihiko Hasegawa, Yasuyoshi Kuroda | 1995-04-11 |
| 5317836 | Apparatus for polishing chamfers of a wafer | Fumihiko Hasegawa, Masayuki Yamada, Hiroshi Kawano | 1994-06-07 |
| 5316620 | Method and an apparatus for polishing wafer chamfers | Fumihiko Hasegawa, Hiroshi Kawano, Masayuki Yamada | 1994-05-31 |