Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342467 | Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component | Hideo Nakagawa, Yoshinori Ogawa, Nobuaki Matsumoto, Shuhei Ueda, Kohei Otake | 2025-06-24 |
| 11862754 | Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2024-01-02 |
| 11862755 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2024-01-02 |
| 11417799 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2022-08-16 |