QG

Qing-Cao Gan

SC Shenzhen Valuelink E-Commerce Co.: 30 patents #1 of 10Top 10%
AT Agilent Technologies: 6 patents #357 of 3,411Top 15%
SS Skyworks Solutions: 3 patents #430 of 948Top 50%
📍 Nanhu, CA: #15 of 269 inventorsTop 6%
Overall (All Time): #82,829 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 26–39 of 39 patents

Patent #TitleCo-InventorsDate
D838747 Inflator pump 2019-01-22
D838748 Inflator pump 2019-01-22
D838749 Inflator pump 2019-01-22
D838744 Mobile DVD player 2019-01-22
D834636 Projector 2018-11-27
7696064 Methods for forming a through via Anthony James LoBianco 2010-04-13
7629201 Method for fabricating a wafer level package with device wafer and passive component integration Robert W. Warren, Anthony James LoBianco, Steve Xin Liang 2009-12-08
7576426 Wafer level package including a device wafer integrated with a passive component Robert W. Warren, Anthony James LoBianco, Steve Xin Liang 2009-08-18
6979597 Wafer-level package with silicon gasket Frank S. Geefay, Ann Mattos, Domingo Figueredo 2005-12-27
6903012 Sloped via contacts Frank S. Geefay 2005-06-07
6787897 Wafer-level package with silicon gasket Frank S. Geefay, Ann Mattos, Domingo Figueredo 2004-09-07
6777267 Die singulation using deep silicon etching Richard C. Ruby, Frank S. Geefay, Cheol Han, Andrew Thomas Barfknecht 2004-08-17
6777263 Film deposition to enhance sealing yield of microcap wafer-level package with vias Richard C. Ruby, Frank S. Geefay, Andrew Thomas Barfknecht 2004-08-17
6763702 Method and apparatus for hermeticity determination and leak detection in semiconductor packaging Allen Chien, Frank S. Geefay, Cheol Han 2004-07-20