Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8102044 | Bonded wafer structure and method of fabrication | Richard C. Ruby, James P. Roland | 2012-01-24 |
| 7554177 | Attachment system incorporating a recess in a structure | David Dutton, Qing Bai | 2009-06-30 |
| 7422929 | Wafer-level packaging of optoelectronic devices | Kendra Gallup, Ronald Fazzio, Martha Johnson, Carrie Ann Guthrie, Tanya Jegeris Snyder +1 more | 2008-09-09 |
| 7161283 | Method for placing metal contacts underneath FBAR resonators | — | 2007-01-09 |
| 6979597 | Wafer-level package with silicon gasket | Qing-Cao Gan, Ann Mattos, Domingo Figueredo | 2005-12-27 |
| 6953990 | Wafer-level packaging of optoelectronic devices | Kendra Gallup, Ronald Fazzio, Martha Johnson, Carrie Ann Guthrie, Tanya Jegeris Snyder +1 more | 2005-10-11 |
| 6919222 | Method for sealing a semiconductor device and apparatus embodying the method | — | 2005-07-19 |
| 6903012 | Sloped via contacts | Qing-Cao Gan | 2005-06-07 |
| 6836013 | Method for sealing a semiconductor device and apparatus embodying the method | — | 2004-12-28 |
| 6787897 | Wafer-level package with silicon gasket | Qing-Cao Gan, Ann Mattos, Domingo Figueredo | 2004-09-07 |
| 6777263 | Film deposition to enhance sealing yield of microcap wafer-level package with vias | Qing-Cao Gan, Richard C. Ruby, Andrew Thomas Barfknecht | 2004-08-17 |
| 6777267 | Die singulation using deep silicon etching | Richard C. Ruby, Cheol Han, Qing-Cao Gan, Andrew Thomas Barfknecht | 2004-08-17 |
| 6763702 | Method and apparatus for hermeticity determination and leak detection in semiconductor packaging | Allen Chien, Cheol Han, Qing-Cao Gan | 2004-07-20 |
| 6555440 | Process for fabricating a top side pitted diode device | — | 2003-04-29 |
| 6429511 | Microcap wafer-level package | Richard C. Ruby, Tracy E. Bell, Yogesh M. Desai | 2002-08-06 |
| 6376280 | Microcap wafer-level package | Richard C. Ruby, Tracy E. Bell, Yogesh M. Desai | 2002-04-23 |
| 6265246 | Microcap wafer-level package | Richard C. Ruby, Tracy E. Bell, Yogesh M. Desai | 2001-07-24 |
| 6228675 | Microcap wafer-level package with vias | Richard C. Ruby, Tracy E. Bell, Yogesh M. Desai | 2001-05-08 |