Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5252639 | Molding resin composition and molded electronic component | Shinetsu Fujieda, Akira Yoshizumi, Hisayuki Hirai | 1993-10-12 |
| 5043211 | Epoxy resin composition and a resin-sealed semiconductor device | Akira Yoshizumi, Shinetsu Fujieda, Ken Uchida | 1991-08-27 |
| 4719255 | Epoxy resin composition for encapsulation of semi-conductor device | Akira Yoshizumi, Hisayuki Hirai, Shinetsu Fujieda, Michiya Higashi | 1988-01-12 |
| 4572853 | Resin encapsulation type semiconductor device | Hirotoshi Ikeya, Shuichi Suzuki, Takayuki Oguni, Akiko Hatanaka | 1986-02-25 |