Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9808890 | Solder alloy | Hikaru Nomura | 2017-11-07 |
| 9780055 | Lead-free solder ball | Yoshie Yamanaka, Ken Tachibana, Hikaru Nomura | 2017-10-03 |
| 9773721 | Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part | Yoshie Yamanaka, Tsukasa Ohnishi, Seiko Ishibashi, Koji Watanabe, Hiroki Ishikawa +1 more | 2017-09-26 |
| 8975757 | Lead-free solder connection structure and solder ball | Minoru Ueshima, Masayuki Suzuki, Yoshie Yamanaka, Tokuro Yamaki, Tsukasa Ohnishi | 2015-03-10 |
| 8932519 | Solder alloy | Seiko Ishibashi, Tsukasa Ohnishi | 2015-01-13 |
| 8896119 | Bonding material for semiconductor devices | Yoshitsugu Sakamoto, Hiroyuki Yamada, Yoshie Yamanaka, Tsukasa Ohnishi, Kenzo Tadokoro | 2014-11-25 |