XN

Xian J. Ning

S( Semiconductor Manufacturing International (Shanghai): 17 patents #20 of 1,122Top 2%
Infineon Technologies Ag: 16 patents #596 of 7,486Top 8%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
IBM: 3 patents #26,272 of 70,183Top 40%
S( Semiconductor Manufacturing International (Beijing): 1 patents #301 of 689Top 45%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
📍 Potsdam, NY: #6 of 231 inventorsTop 3%
🗺 New York: #2,966 of 115,490 inventorsTop 3%
Overall (All Time): #90,766 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 26–37 of 37 patents

Patent #TitleCo-InventorsDate
6709874 Method of manufacturing a metal cap layer for preventing damascene conductive lines from oxidation 2004-03-23
6706588 Method of fabricating an integrated circuit having embedded vertical capacitor 2004-03-16
6692898 Self-aligned conductive line for cross-point magnetic memory integrated circuits 2004-02-17
6677635 Stacked MIMCap between Cu dual damascene levels Yi-Sheng Hsieh 2004-01-13
6620701 Method of fabricating a metal-insulator-metal (MIM) capacitor 2003-09-16
6611453 Self-aligned cross-point MRAM device with aluminum metallization layers 2003-08-26
6451667 Self-aligned double-sided vertical MIMcap 2002-09-17
6440753 Metal hard mask for ILD RIE processing of semiconductor memory devices to prevent oxidation of conductive lines Joachim Nuetzel 2002-08-27
6184134 Dry process for cleaning residues/polymers after metal etch Nirmal Chaudhary, George Stojakovic 2001-02-06
6033984 Dual damascene with bond pads Rainer Florian Schnabel, Bruno Spuler 2000-03-07
5903343 Method for detecting under-etched vias Rainer Florian Schnabel 1999-05-11
5865901 Wafer surface cleaning apparatus and method Xiaoming Yin 1999-02-02