Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9928934 | Curable composition for electronic component and connection structure | Takashi Kubota | 2018-03-27 |
| 9490046 | Conductive material and connected structure | Takashi Kubota | 2016-11-08 |
| 9446484 | Conductive particles, method for producing conductive particles, conductive material and connection structure | Ryohei Masui, Takashi Kubota | 2016-09-20 |
| 8901207 | Adhesive for electronic components | Akinobu Hayakawa, Kohei Takeda, Ryohei Masui | 2014-12-02 |
| 8802989 | Conductive material and connection structure | Takashi Kubota | 2014-08-12 |
| 8563362 | Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles | Akinobu Hayakawa, Kohei Takeda, Ryohei Masui | 2013-10-22 |
| 8119323 | Process for producing patterned film and photosensitive resin composition | Hiroji Fukui, Kenichi Aoki, Kunihiro Ichimura, Minoru Suezaki, Toshio Enami +2 more | 2012-02-21 |
| 7915743 | Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device | Akinobu Hayakawa | 2011-03-29 |
| 7838577 | Adhesive for electronic component | Akinobu Hayakawa, Kohei Takeda, Ryohei Masui | 2010-11-23 |
| 7262231 | Photosensitive amine generator, photocurable composition and photoreactive adhesive composition | Hiroji Fukui, Takeo Kuroda | 2007-08-28 |
| 7012123 | Acrylic polymer and charge transport material | Tamaki Nakano | 2006-03-14 |
| 6864300 | Photoreactive adhesive composition and method of bonding with the same | — | 2005-03-08 |
| 6641912 | Photocurable pressure-sensitive adhesive composition and its sheet | Munehiro Hatai, Masakazu Nakata, Motohiro Yagi | 2003-11-04 |