Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10131826 | Adhesive film for semiconductor chip with through electrode | Mai Nagata, Kohei Takeda | 2018-11-20 |
| 8119323 | Process for producing patterned film and photosensitive resin composition | Hiroji Fukui, Kenichi Aoki, Kunihiro Ichimura, Minoru Suezaki, Hideaki Ishizawa +2 more | 2012-02-21 |
| 7645514 | Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body | Koji Watanabe, Yoshiyuki Takebe, Tatsuo Suzuki | 2010-01-12 |
| 7591921 | Heat-decaying materials, transfer sheet using the same, and patterning method | Hiroji Fukui | 2009-09-22 |
| 6635962 | Chip on chip semiconductor device | Kazutaka Shibata, Shigeyuki Ueda | 2003-10-21 |