Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9446484 | Conductive particles, method for producing conductive particles, conductive material and connection structure | Takashi Kubota, Hideaki Ishizawa | 2016-09-20 |
| 8901207 | Adhesive for electronic components | Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda | 2014-12-02 |
| 8563362 | Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles | Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda | 2013-10-22 |
| 7838577 | Adhesive for electronic component | Akinobu Hayakawa, Hideaki Ishizawa, Kohei Takeda | 2010-11-23 |