Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8729695 | Wafer level package and a method of forming a wafer level package | Chirayarikathu Veedu Sankarapillai Premachandran, Rakesh Kumar, Nagarajan Ranganathan, Won Kyoung Choi, Ebin Liao +2 more | 2014-05-20 |
| 8212325 | Electrostatic vibrator and electronic apparatus | Fumio Kimura, Ryohei Kamiya, Hiroshi Takahashi, Yoshifumi Yoshida | 2012-07-03 |