Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12226822 | Additive manufacturing process of 3D electronic substrate | Mark Kostinovsky | 2025-02-18 |
| 11770906 | 3D-printed ceramics with conductor infusion for ultra-high-speed electronics | John Michael Beshears | 2023-09-26 |
| 11765839 | Additive manufactured 3D electronic substrate | Mark Kostinovsky, Lweness Mazari | 2023-09-19 |
| 11676926 | Solder joints on nickel surface finishes without gold plating | Mark Kostinovsky, Lweness Mazari | 2023-06-13 |
| 11329023 | Interconnection of copper surfaces using copper sintering material | Mark Kostinovsky, Lweness Mazari | 2022-05-10 |
| 7881068 | Composite layer for an electronic device | Ramin Vatanparast, Mikko Aarras, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen +3 more | 2011-02-01 |
| D615186 | Chemical reaction activation plunger | Julian Ross, Scott Freeman, Steven Johnson, Tomas Cervenka, Martin Wieting | 2010-05-04 |
| 7523546 | Method for manufacturing a composite layer for an electronic device | Ramin Vatanparast, Mikko Aarras, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen +3 more | 2009-04-28 |
| 6802119 | Conductive pedestal on pad for leadless chip carrier (LCC) standoff | — | 2004-10-12 |
| 6472611 | Conductive pedestal on pad for leadless chip carrier (LCC) standoff | — | 2002-10-29 |