Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765839 | Additive manufactured 3D electronic substrate | Steven O. Dunford, Mark Kostinovsky | 2023-09-19 |
| 11676926 | Solder joints on nickel surface finishes without gold plating | Mark Kostinovsky, Steven O. Dunford | 2023-06-13 |
| 11329023 | Interconnection of copper surfaces using copper sintering material | Mark Kostinovsky, Steven O. Dunford | 2022-05-10 |