Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12226822 | Additive manufacturing process of 3D electronic substrate | Steven O. Dunford | 2025-02-18 |
| 11765839 | Additive manufactured 3D electronic substrate | Steven O. Dunford, Lweness Mazari | 2023-09-19 |
| 11676926 | Solder joints on nickel surface finishes without gold plating | Steven O. Dunford, Lweness Mazari | 2023-06-13 |
| 11329023 | Interconnection of copper surfaces using copper sintering material | Steven O. Dunford, Lweness Mazari | 2022-05-10 |
| 10376995 | Tin-antimony-based high temperature solder for downhole components | Francis Dupouy, Suriyakan Vongtragool Kleitz, Chandradip Pravinbhai Patel | 2019-08-13 |
| 10180035 | Soldered components for downhole use | Chandradip Pravinbhai Patel, Francis Dupouy, Glen Dell Schilling, Gilles Iafrate, F. Patrick McCluskey | 2019-01-15 |