Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5643738 | Method of synthesis of plurality of compounds in parallel using a partitioned solid support | Peter John Zanzucchi, Sterling Edward McBride, Amrit K. Judd | 1997-07-01 |
| 5644327 | Tessellated electroluminescent display having a multilayer ceramic substrate | Lubomyr Stephen Onyskevych, Ashok N. Prabhu, P. Niel Yocom, Kenneth Edward Salsman | 1997-07-01 |
| 5632876 | Apparatus and methods for controlling fluid flow in microchannels | Peter John Zanzucchi, Sterling Edward McBride, Charlotte Anna Burton | 1997-05-27 |
| 5603351 | Method and system for inhibiting cross-contamination in fluids of combinatorial chemistry device | Robert R. Demers, Zhong Fan, Aaron William Levine, Sterling Edward McBride, Peter John Zanzucchi | 1997-02-18 |
| 5593838 | Partitioned microelectronic device array | Peter John Zanzucchi, Sterling Edward McBride, Amrit K. Judd | 1997-01-14 |
| 5585069 | Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis | Peter John Zanzucchi, Sterling Edward McBride | 1996-12-17 |
| 5047371 | Glass/ceramic sealing system | — | 1991-09-10 |
| 5043222 | Metal sealing glass composite with matched coefficients of thermal expansion | — | 1991-08-27 |
| 4978052 | Semiconductor die attach system | Julius C. Fister, Deepak Mahulikar, Brian E. O'Donnelly | 1990-12-18 |
| 4952531 | Sealing glass for matched sealing of copper and copper alloys | — | 1990-08-28 |
| 4929516 | Semiconductor die attach system | Michael J. Pryor, Julius C. Fister, Narendra N. SinghDeo, Deepak Mahulikar | 1990-05-29 |
| 4872047 | Semiconductor die attach system | Julius C. Fister, Deepak Mahulikar, Brian E. O'Donnelly | 1989-10-03 |
| 4796083 | Semiconductor casing | Sheldon H. Butt | 1989-01-03 |
| 4769345 | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor | Sheldon H. Butt | 1988-09-06 |
| 4704626 | Graded sealing systems for semiconductor package | Deepak Mahulikar | 1987-11-03 |