Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935917 | Semiconductor structure forming method and semiconductor structure | — | 2024-03-19 |
| 11929255 | Method of high-density pattern forming | — | 2024-03-12 |
| 11430745 | Semiconductor die containing silicon nitride stress compensating regions and method for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-08-30 |
| 11362079 | Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same | Peter Rabkin, Masaaki Higashitani | 2022-06-14 |
| 11276705 | Embedded bonded assembly and method for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-03-15 |
| 11270963 | Bonding pads including interfacial electromigration barrier layers and methods of making the same | Peter Rabkin, Masaaki Higashitani | 2022-03-08 |
| 11239204 | Bonded assembly containing laterally bonded bonding pads and methods of forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-02-01 |
| 11094653 | Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2021-08-17 |
| 11088116 | Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2021-08-10 |
| 11037908 | Bonded die assembly containing partially filled through-substrate via structures and methods for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2021-06-15 |
| 11004773 | Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2021-05-11 |