| 11935917 |
Semiconductor structure forming method and semiconductor structure |
— |
2024-03-19 |
| 11929255 |
Method of high-density pattern forming |
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2024-03-12 |
| 11430745 |
Semiconductor die containing silicon nitride stress compensating regions and method for making the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2022-08-30 |
| 11362079 |
Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same |
Peter Rabkin, Masaaki Higashitani |
2022-06-14 |
| 11276705 |
Embedded bonded assembly and method for making the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2022-03-15 |
| 11270963 |
Bonding pads including interfacial electromigration barrier layers and methods of making the same |
Peter Rabkin, Masaaki Higashitani |
2022-03-08 |
| 11239204 |
Bonded assembly containing laterally bonded bonding pads and methods of forming the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2022-02-01 |
| 11094653 |
Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2021-08-17 |
| 11088116 |
Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same |
Peter Rabkin, Masaaki Higashitani |
2021-08-10 |
| 11037908 |
Bonded die assembly containing partially filled through-substrate via structures and methods for making the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2021-06-15 |
| 11004773 |
Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same |
Peter Rabkin, Masaaki Higashitani |
2021-05-11 |