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USPTO Patent Rankings Data through Dec 31, 2025
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Chen Wu — 11 Patents

STSandisk Technologies: 9 patents #451 of 2,594Top 20%
CTChangxin Memory Technologies: 2 patents #237 of 743Top 35%
Leuven, BE: #67 of 851 inventorsTop 8%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Chen Wu has been granted 11 US patents while listed as an inventor at Sandisk Technologies. The first was granted in 2021 and the most recent in March 2024. Chen Wu ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Chen Wu in Leuven, BE.

Patents per Year

Patents granted per year, 2021 to 2024Bar chart with a peak of 5 patents in 2022.peak 52021: 4 patents20212022: 5 patents20222024: 2 patents2024

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
11935917 Semiconductor structure forming method and semiconductor structure — 2024-03-19
11929255 Method of high-density pattern forming — 2024-03-12
11430745 Semiconductor die containing silicon nitride stress compensating regions and method for making the same Peter Rabkin, Yangyin Chen, Masaaki Higashitani 2022-08-30
11362079 Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same Peter Rabkin, Masaaki Higashitani 2022-06-14
11276705 Embedded bonded assembly and method for making the same Peter Rabkin, Yangyin Chen, Masaaki Higashitani 2022-03-15
11270963 Bonding pads including interfacial electromigration barrier layers and methods of making the same Peter Rabkin, Masaaki Higashitani 2022-03-08
11239204 Bonded assembly containing laterally bonded bonding pads and methods of forming the same Peter Rabkin, Yangyin Chen, Masaaki Higashitani 2022-02-01
11094653 Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same Peter Rabkin, Yangyin Chen, Masaaki Higashitani 2021-08-17
11088116 Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same Peter Rabkin, Masaaki Higashitani 2021-08-10
11037908 Bonded die assembly containing partially filled through-substrate via structures and methods for making the same Peter Rabkin, Yangyin Chen, Masaaki Higashitani 2021-06-15
11004773 Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same Peter Rabkin, Masaaki Higashitani 2021-05-11

Frequent Collaborators

Masaaki Higashitani9 shared
Peter Rabkin9 shared
Yangyin Chen5 shared

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11