Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9732183 | Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board | Kazuya Takahashi, Kazunori Kitamura | 2017-08-15 |
| 9201299 | Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same | Toshimitsu Kounou, Yasuhiro Kuroyanagai, Makoto OBUNAI | 2015-12-01 |