Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9732183 | Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board | Yukihiro USUI, Kazuya Takahashi | 2017-08-15 |
| 9565754 | Solder-mounted board, production method therefor, and semiconductor device | — | 2017-02-07 |
| 9415469 | Resin composition for solder bump formation, solder bump formation method, and member having solder bumps | Yasuhiro Takase, Kazuki Hanada | 2016-08-16 |
| 9072205 | Surface mounting method utilizing active resin composition | Yasuhiro Takase, Kazuki Hanada | 2015-06-30 |
| 8758986 | Printed wiring board and method for producing the same | Takeshi Saito, Yukihiro Koga | 2014-06-24 |
| 8551819 | Method for surface mounting using cleaning-free activated resinous composition | Yasuhiro Takase | 2013-10-08 |
| 8232477 | Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board | Yukihiro Koga, Kiyoshi Sato | 2012-07-31 |
| 7410673 | Smooth board and process for preparing a smooth board | Kiyoshi Sato | 2008-08-12 |
| 7396885 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | Kiyoshi Sato | 2008-07-08 |
| 6812299 | Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin | Kiyoshi Sato | 2004-11-02 |
| 4988130 | Metal seal flange assembly | Kenjiro Obara, Kazuyuki Nakamura, Yoshio Murakami, Masamitsu Naganuma, Takao Uchida | 1991-01-29 |