TK

Toshimitsu Kounou

SC San-Ei Kagaku Co.: 1 patents #12 of 27Top 45%
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Patent #TitleCo-InventorsDate
9201299 Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same Yasuhiro Kuroyanagai, Yukihiro USUI, Makoto OBUNAI 2015-12-01