Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592708 | Package board, semiconductor package, and fabricating method thereof | Seung-Gu Kim, Je-Gwang Yoo, Yong-Bin Lee, Seok-Hwan Huh, Chang-Sup Ryu | 2009-09-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592708 | Package board, semiconductor package, and fabricating method thereof | Seung-Gu Kim, Je-Gwang Yoo, Yong-Bin Lee, Seok-Hwan Huh, Chang-Sup Ryu | 2009-09-22 |