YL

Yong-Bin Lee

Samsung: 1 patents #49,284 of 75,807Top 70%
📍 Cheongju-si, KR: #489 of 787 inventorsTop 65%
Overall (All Time): #3,336,165 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7592708 Package board, semiconductor package, and fabricating method thereof Seung-Gu Kim, Je-Gwang Yoo, Yoo-Keum Wee, Seok-Hwan Huh, Chang-Sup Ryu 2009-09-22