Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218065 | Semiconductor package including adhesive layer and method for manufacturing the same | Ilho Kim | 2025-02-04 |
| 11557560 | Semiconductor package for improving reliability | Hyungsun Jang | 2023-01-17 |
| 11513548 | Apparatus and method for tracking maximum power | Chisung BAE, Hyungmin Gi, Yoonmyung Lee | 2022-11-29 |