Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218068 | Through electrode substrate, electronic unit, method for manufacturing through electrode substrate, and method for manufacturing electronic unit | Hiroshi Kudo, Shohei Yamada | 2025-02-04 |
| 11430730 | Wiring substrate and semiconductor device | Yuki Aritsuka, Takamasa Takano, Masaya Tanaka, Yumi Yoshii, Shuji Sagara | 2022-08-30 |
| 8288772 | Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate | Shinji Maekawa | 2012-10-16 |