Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406917 | Semiconductor package and method of manufacturing the semiconductor package | Geunwoo KIM, Jiwon Shin, Donguk Kwon, Kwangbok Woo | 2025-09-02 |
| 12288745 | Semiconductor package | Donguk Kwon, Jiwon Shin, Pilsung CHOI | 2025-04-29 |
| 12005520 | Laser bonding apparatus and method | Seonyoung Kim, Hyesun Yoon, Young-Chul Park | 2024-06-11 |
| 11229124 | Method for forming redistribution layer using photo-sintering | Seungboo Jung, Kwangho JUNG, Haksan Jeong, BumGeun Park, Choongjae Lee +1 more | 2022-01-18 |