Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406917 | Semiconductor package and method of manufacturing the semiconductor package | Geunwoo KIM, Jiwon Shin, Wooram MYUNG, Kwangbok Woo | 2025-09-02 |
| 12288745 | Semiconductor package | Wooram MYUNG, Jiwon Shin, Pilsung CHOI | 2025-04-29 |
| 12272652 | Semiconductor package | Jiwon Shin, Kwang Bok Woo, MINSEUNG JI | 2025-04-08 |
| 11749592 | Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor package | Jiwon Shin, Kwangbok Woo, MINSEUNG JI | 2023-09-05 |
| 11676904 | Semiconductor package | Jiwon Shin, Kwang Bok Woo, MINSEUNG JI | 2023-06-13 |