Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406917 | Semiconductor package and method of manufacturing the semiconductor package | Geunwoo KIM, Jiwon Shin, Donguk Kwon, Wooram MYUNG | 2025-09-02 |
| 11749592 | Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor package | Donguk Kwon, Jiwon Shin, MINSEUNG JI | 2023-09-05 |