TK

Tomoyuki Kikuchi

Samsung: 10 patents #13,191 of 75,807Top 20%
TE Tessera: 9 patents #45 of 271Top 20%
FU Fujifilm: 1 patents #3,076 of 4,519Top 70%
FL Fujitsu Semiconductor Limited: 1 patents #612 of 1,301Top 50%
NU National University Corporation, Iwate University: 1 patents #30 of 99Top 35%
Overall (All Time): #202,788 of 4,157,543Top 5%
21
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12384965 Copolymer, electroluminescent device material including copolymer, and electroluminescent device Takahiro Fujiyama, Fumiaki Kato, Masashi Tsuji, Naotoshi Suganuma, Norihito Ishii +4 more 2025-08-12
11993725 Barrier films and quantum dot polymer composite articles including the same Eunjoo Jang, Hyun A Kang, Nayoun Won, Oul Cho 2024-05-28
11917899 Arylamine-fluorene alternating copolymer, electroluminescence device material, and electroluminescence device using the polymer Masashi Tsuji, Takahiro Fujiyama, Yusaku KONISHI, Dae Young CHUNG, Fumiaki Kato +7 more 2024-02-27
11851529 Triazine ring-containing polymer, and thermoplastic article and optical part including same Yoshiyuki Oishi, Eigo MIYAZAKI, Yukika Yamada 2023-12-26
11830845 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2023-11-28
11814482 Triazine ring-containing polymer, and thermoplastic article and optical part including same Eigo MIYAZAKI, Masashi Tsuji, Yukika Yamada 2023-11-14
11424211 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2022-08-23
11312840 Organic-inorganic hybrid composition, and article and optical component including the same Yoshiyuki Oishi, Ryosuke Kamitani, Yukika Yamada 2022-04-26
11180612 Triazine ring-containing polymer, and thermoplastic article and optical component including the same Yoshiyuki Oishi, Ryosuke Kamitani, Yukika Yamada 2021-11-23
10833044 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2020-11-10
10717866 Organic-inorganic hybrid composition, and article and optical component including the same Yoshiyuki Oishi, Hiroshi Miyao, Yukika Yamada, Ryosuke Kamitani 2020-07-21
10593643 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2020-03-17
10559726 Layered structures and quantum dot sheets and electronic devices including the same Hyun A Kang, Nayoun Won, Eun Joo JANG, Ha Il KWON, Jeong Hee Lee +1 more 2020-02-11
10062661 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2018-08-28
10053556 Barrier coating compositions, composites prepared therefrom, and quantum dot polymer composite articles including the same Eunjoo Jang, Hyun A Kang, Nayoun Won, Oul Cho, Haeng Deog KOH 2018-08-21
9691731 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2017-06-27
9224717 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2015-12-29
9093435 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2015-07-28
8618659 Package-on-package assembly with wire bonds to encapsulation surface Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more 2013-12-31
8598045 Semiconductor device and method for manufacturing the same Hideaki Kikuchi, Kouichi Nagai 2013-12-03
8158307 Color filter and method of manufacturing the same, and solid-state image pickup element Mitsuji Yoshibayashi, Teruaki Kinumura 2012-04-17