| 12384965 |
Copolymer, electroluminescent device material including copolymer, and electroluminescent device |
Takahiro Fujiyama, Fumiaki Kato, Masashi Tsuji, Naotoshi Suganuma, Norihito Ishii +4 more |
2025-08-12 |
| 11993725 |
Barrier films and quantum dot polymer composite articles including the same |
Eunjoo Jang, Hyun A Kang, Nayoun Won, Oul Cho |
2024-05-28 |
| 11917899 |
Arylamine-fluorene alternating copolymer, electroluminescence device material, and electroluminescence device using the polymer |
Masashi Tsuji, Takahiro Fujiyama, Yusaku KONISHI, Dae Young CHUNG, Fumiaki Kato +7 more |
2024-02-27 |
| 11851529 |
Triazine ring-containing polymer, and thermoplastic article and optical part including same |
Yoshiyuki Oishi, Eigo MIYAZAKI, Yukika Yamada |
2023-12-26 |
| 11830845 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2023-11-28 |
| 11814482 |
Triazine ring-containing polymer, and thermoplastic article and optical part including same |
Eigo MIYAZAKI, Masashi Tsuji, Yukika Yamada |
2023-11-14 |
| 11424211 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2022-08-23 |
| 11312840 |
Organic-inorganic hybrid composition, and article and optical component including the same |
Yoshiyuki Oishi, Ryosuke Kamitani, Yukika Yamada |
2022-04-26 |
| 11180612 |
Triazine ring-containing polymer, and thermoplastic article and optical component including the same |
Yoshiyuki Oishi, Ryosuke Kamitani, Yukika Yamada |
2021-11-23 |
| 10833044 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-11-10 |
| 10717866 |
Organic-inorganic hybrid composition, and article and optical component including the same |
Yoshiyuki Oishi, Hiroshi Miyao, Yukika Yamada, Ryosuke Kamitani |
2020-07-21 |
| 10593643 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-03-17 |
| 10559726 |
Layered structures and quantum dot sheets and electronic devices including the same |
Hyun A Kang, Nayoun Won, Eun Joo JANG, Ha Il KWON, Jeong Hee Lee +1 more |
2020-02-11 |
| 10062661 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2018-08-28 |
| 10053556 |
Barrier coating compositions, composites prepared therefrom, and quantum dot polymer composite articles including the same |
Eunjoo Jang, Hyun A Kang, Nayoun Won, Oul Cho, Haeng Deog KOH |
2018-08-21 |
| 9691731 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2017-06-27 |
| 9224717 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2015-12-29 |
| 9093435 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2015-07-28 |
| 8618659 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2013-12-31 |
| 8598045 |
Semiconductor device and method for manufacturing the same |
Hideaki Kikuchi, Kouichi Nagai |
2013-12-03 |
| 8158307 |
Color filter and method of manufacturing the same, and solid-state image pickup element |
Mitsuji Yoshibayashi, Teruaki Kinumura |
2012-04-17 |