Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412875 | Semiconductor package | — | 2025-09-09 |
| 12381090 | Etching method and etching apparatus | Toshinori Debari, Reiko SASAHARA, Teppei Okumura, Woonghyun Jeung, Kenshiro ASAHI +1 more | 2025-08-05 |
| 12002763 | Package substrate and semiconductor package including the same | — | 2024-06-04 |
| 11810865 | Semiconductor package with marking pattern | — | 2023-11-07 |
| 11552022 | Package substrate and semiconductor package including the same | — | 2023-01-10 |