Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851256 | Method of manufacturing chip-on-chip semiconductor device | Hyun-Soo Chung, Dong-Ho Lee, Sun-Won Kang, Seung-Duk Baek | 2010-12-14 |
| 7847416 | Wafer level package and method of fabricating the same | Hyun-Soo Chung, In-Young Lee, Son-Kwan Hwang, Dong-Ho Lee | 2010-12-07 |
| 7626260 | Stack-type semiconductor device having cooling path on its bottom surface | Hyun-Soo Chung, Cha-Jea Jo, Dong-Ho Lee | 2009-12-01 |
| 7544538 | Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same | Hyun-Soo Chung, Seung-Kwan Ryu, Ju-Il Choi, Dong-Ho Lee | 2009-06-09 |