Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7229875 | Integrated circuit capacitor structure | Kyoung-Woo Lee, Wan Jae Park, Jeong Hoon Ahn, Mu-kyeng Jung, Yong Jun Lee +2 more | 2007-06-12 |
| 7220652 | Metal-insulator-metal capacitor and interconnecting structure | Yoon-Hae Kim, Seong-ho Liu | 2007-05-22 |
| 7208791 | Integrated circuit devices including a capacitor | Byung-jun Oh, Mu-kyeng Jung | 2007-04-24 |
| 7202160 | Method of forming an insulating structure having an insulating interlayer and a capping layer and method of forming a metal wiring structure using the same | Yoon-Hae Kim, Yong Jun Lee | 2007-04-10 |
| 7183202 | Method of forming metal wiring in a semiconductor device | Sang Jin Lee, Byung-jun Oh | 2007-02-27 |
| 7030022 | Method of manufacturing semiconductor device having metal interconnections of different thickness | Mu-Kyoung Jung | 2006-04-18 |
| 6953745 | Void-free metal interconnection structure and method of forming the same | Jeong Hoon Ahn, Hyo-Jong Lee, Kyoung-Woo Lee, Soo-geun Lee, Bong Seok Suh | 2005-10-11 |
| 6940114 | Integrated circuit devices including a MIM capacitor | Byung-jun Oh, Mu-kyeng Jung | 2005-09-06 |
| 6911397 | Method of forming dual damascene interconnection using low-k dielectric | Jin-Won Jun, Young-Wug Kim, Tae Soo Park | 2005-06-28 |
| 6833102 | Leg manifold mounting arrangement | Filippo Martino, Vincent Travaglini, Gary Fong | 2004-12-21 |
| 6746951 | Bond pad of semiconductor device and method of fabricating the same | Seong-ho Liu | 2004-06-08 |
| 6498092 | Method of making a semiconductor device having dual damascene line structure using a patterned etching stopper | Seong-ho Liu | 2002-12-24 |
| 6492260 | Method of fabricating damascene metal wiring | Young-Wug Kim | 2002-12-10 |
| 6089852 | Mold centering arrangement for injection molding apparatus | Vincent Travaglini, Joseph Robert Klanfar | 2000-07-18 |