Issued Patents All Time
Showing 51–58 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483162 | Semiconductor device having improved metal line structure and manufacturing method therefor | Dong-chul Kwon, Young-Jin Wee, Sung Jin Kim | 2002-11-19 |
| 6432843 | Methods of manufacturing integrated circuit devices in which a spin on glass insulation layer is dissolved so as to recess the spin on glass insulation layer from the upper surface of a pattern | Jae Hak Kim | 2002-08-13 |
| 6368906 | Method of planarization using selecting curing of SOG layer | Ju-Seon Goo | 2002-04-09 |
| 6333260 | Semiconductor device having improved metal line structure and manufacturing method therefor | Dong-chul Kwon, Young-Jin Wee, Sung Jin Kim | 2001-12-25 |
| 6294315 | Method of forming a metal wiring by a dual damascene process using a photosensitive polymer | Byeong-Jun Kim | 2001-09-25 |
| 6277764 | Interlayered dielectric layer of semiconductor device and method of manufacturing the same | Hee-Sook Park, Sung Jin Kim | 2001-08-21 |
| 6218079 | Method for metalization by dual damascene process using photosensitive polymer | Byeong-Jun Kim | 2001-04-17 |
| 5629238 | Method for forming conductive line of semiconductor device | Ji Hyun Choi, Byung Keun Hwang, U-in Chung | 1997-05-13 |