Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10588220 | Dry method of metallizing polymer thick film surfaces | — | 2020-03-10 |
| 10525673 | Composite pane with a capacitive switching zone | Stefan Droste | 2020-01-07 |
| 10523201 | Pane arrangement with pane with low-E coating and capacitive switching region | Stefan Droste, Klaus Schmalbuch, Pascal Bauerle | 2019-12-31 |
| 10201233 | Modular basin apparatus | David Grisham | 2019-02-12 |
| 9900932 | Panel heater with temperature monitoring | Christoph Degen, Dang Cuong Phan, Mitja Rateiczak, Andreas Schlarb, Stefan Droste +5 more | 2018-02-20 |
| D791294 | Modular fire pit | David Grisham | 2017-07-04 |
| 9651191 | Modular basin apparatus | David Grisham | 2017-05-16 |
| 9105417 | Method for controlling the opening or closing of an electric circuit in an electric meter | — | 2015-08-11 |
| 8555102 | Method for managing the operation of a remote information sensor, and associated sensor | Jean-Michel Gaudin | 2013-10-08 |
| 7831323 | Control system and method therefor | Suresh Viswanathan | 2010-11-09 |
| 7171281 | Control system and method therefor | Suresh Viswanathan | 2007-01-30 |
| 7049166 | Methods and apparatus for making integrated circuit package including opening exposing portion of the IC | Matthew M. Salatino | 2006-05-23 |
| 6667439 | Integrated circuit package including opening exposing portion of an IC | Matthew M. Salatino | 2003-12-23 |
| 6615091 | Control system and method therefor | Bill Birchenough, Mike Naegele, Paul Sonye, Suresh Viswanathan, Kathy Wedig +4 more | 2003-09-02 |
| 6560122 | Chip package with molded underfill | — | 2003-05-06 |
| 6495083 | Method of underfilling an integrated circuit chip | — | 2002-12-17 |
| 6324069 | Chip package with molded underfill | — | 2001-11-27 |
| 6316291 | Method of fabricating a non-laminate carrier substrate utilizing a mold | — | 2001-11-13 |
| 6157086 | Chip package with transfer mold underfill | — | 2000-12-05 |
| 6128195 | Transfer molded PCMCIA standard cards | Michael A. Brueggeman | 2000-10-03 |
| 6038136 | Chip package with molded underfill | — | 2000-03-14 |
| 5929522 | Semiconductor non-laminate package and method | — | 1999-07-27 |
| 5798014 | Methods of making multi-tier laminate substrates for electronic device packaging | — | 1998-08-25 |
| 5776512 | Apparatus for encapsulating electronic packages | — | 1998-07-07 |
| 5766986 | Method of transfer molding electronic packages and packages produced thereby | Michael A. Brueggeman | 1998-06-16 |