Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5728248 | Method for making a multi-tier laminate substrate with internal heat spreader | — | 1998-03-17 |
| 5689137 | Method for transfer molding standard electronic packages and apparatus formed thereby | — | 1997-11-18 |
| 5652463 | Transfer modlded electronic package having a passage means | Michael A. Brueggeman | 1997-07-29 |
| 5622588 | Methods of making multi-tier laminate substrates for electronic device packaging | — | 1997-04-22 |
| 5609889 | Apparatus for encapsulating electronic packages | — | 1997-03-11 |
| 5597643 | Multi-tier laminate substrate with internal heat spreader | — | 1997-01-28 |