Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613249 | Finger sensor including encapsulating layer over sensing area and related methods | Anthony Iantosca | 2017-04-04 |
| 8736001 | Finger sensor including encapsulating layer over sensing area and related methods | Anthony Iantosca | 2014-05-27 |
| 8085998 | Finger sensor including enhanced ESD protection and associated methods | Dale R. Setlak, Philip J. Spletter, Yang Rao | 2011-12-27 |
| 7894643 | Finger sensor including flexible circuit and associated methods | Dale R. Setlak, Philip J. Spletter, Yang Rao | 2011-02-22 |
| 7599532 | Finger sensing with enhanced mounting and associated methods | Dale R. Setlak, Philip J. Spletter, Yang Rao | 2009-10-06 |
| 7424136 | Finger sensing with enhanced mounting and associated methods | Dale R. Setlak, Philip J. Spletter, Yang Rao | 2008-09-09 |
| 7076089 | Fingerprint sensor having enhanced ESD protection and associated methods | Robert S. Brandt, II, David Carl Gebauer, Dale R. Setlak, Peter Sherlock | 2006-07-11 |
| 7049166 | Methods and apparatus for making integrated circuit package including opening exposing portion of the IC | Patrick Weber | 2006-05-23 |
| 6667439 | Integrated circuit package including opening exposing portion of an IC | Patrick Weber | 2003-12-23 |
| 6628812 | Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods | Dale R. Setlak, Daryl D. Williams | 2003-09-30 |
| 6088471 | Fingerprint sensor including an anisotropic dielectric coating and associated methods | Dale R. Setlak, Nicolass W. Van Vonno, Mike Newton | 2000-07-11 |
| 6069970 | Fingerprint sensor and token reader and associated methods | Dale R. Setlak, Mike Newton, Cal Adkins, Nicolaas W. Van Vanno | 2000-05-30 |
| 5920640 | Fingerprint sensor and token reader and associated methods | Dale R. Setlak, Mike Newton, Cal Adkins, Nicolaas W. Van Vanno | 1999-07-06 |
| 5915168 | Lid wafer bond packaging and micromachining | William R. Young, Patrick A. Begley | 1999-06-22 |
| 5887343 | Direct chip attachment method | S. James Studebaker, Mike Newton, Dale R. Setlak | 1999-03-30 |
| 5862248 | Integrated circuit device having an opening exposing the integrated circuit die and related methods | S. James Studebaker, Nicolaas W. VanVonno | 1999-01-19 |
| 5798557 | Lid wafer bond packaging and micromachining | William R. Young, Patrick A. Begley | 1998-08-25 |
| 5228192 | Method of manufacturing a multi-layered IC packaging assembly | — | 1993-07-20 |
| 5117282 | Stacked configuration for integrated circuit devices | — | 1992-05-26 |
| 5085084 | Method and apparatus for testing lead bonds and detecting failure | — | 1992-02-04 |