| 9613249 |
Finger sensor including encapsulating layer over sensing area and related methods |
Anthony Iantosca |
2017-04-04 |
| 8736001 |
Finger sensor including encapsulating layer over sensing area and related methods |
Anthony Iantosca |
2014-05-27 |
| 8085998 |
Finger sensor including enhanced ESD protection and associated methods |
Dale R. Setlak, Philip J. Spletter, Yang Rao |
2011-12-27 |
| 7894643 |
Finger sensor including flexible circuit and associated methods |
Dale R. Setlak, Philip J. Spletter, Yang Rao |
2011-02-22 |
| 7599532 |
Finger sensing with enhanced mounting and associated methods |
Dale R. Setlak, Philip J. Spletter, Yang Rao |
2009-10-06 |
| 7424136 |
Finger sensing with enhanced mounting and associated methods |
Dale R. Setlak, Philip J. Spletter, Yang Rao |
2008-09-09 |
| 7076089 |
Fingerprint sensor having enhanced ESD protection and associated methods |
Robert S. Brandt, II, David Carl Gebauer, Dale R. Setlak, Peter Sherlock |
2006-07-11 |
| 7049166 |
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC |
Patrick Weber |
2006-05-23 |
| 6667439 |
Integrated circuit package including opening exposing portion of an IC |
Patrick Weber |
2003-12-23 |
| 6628812 |
Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods |
Dale R. Setlak, Daryl D. Williams |
2003-09-30 |
| 6088471 |
Fingerprint sensor including an anisotropic dielectric coating and associated methods |
Dale R. Setlak, Nicolass W. Van Vonno, Mike Newton |
2000-07-11 |
| 6069970 |
Fingerprint sensor and token reader and associated methods |
Dale R. Setlak, Mike Newton, Cal Adkins, Nicolaas W. Van Vanno |
2000-05-30 |
| 5920640 |
Fingerprint sensor and token reader and associated methods |
Dale R. Setlak, Mike Newton, Cal Adkins, Nicolaas W. Van Vanno |
1999-07-06 |
| 5915168 |
Lid wafer bond packaging and micromachining |
William R. Young, Patrick A. Begley |
1999-06-22 |
| 5887343 |
Direct chip attachment method |
S. James Studebaker, Mike Newton, Dale R. Setlak |
1999-03-30 |
| 5862248 |
Integrated circuit device having an opening exposing the integrated circuit die and related methods |
S. James Studebaker, Nicolaas W. VanVonno |
1999-01-19 |
| 5798557 |
Lid wafer bond packaging and micromachining |
William R. Young, Patrick A. Begley |
1998-08-25 |
| 5228192 |
Method of manufacturing a multi-layered IC packaging assembly |
— |
1993-07-20 |
| 5117282 |
Stacked configuration for integrated circuit devices |
— |
1992-05-26 |
| 5085084 |
Method and apparatus for testing lead bonds and detecting failure |
— |
1992-02-04 |