Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448637 | Hermetically sealed integrated circuit package incorporating pressure relief valve for equalizing interior and exterior pressures when placed in spaceborne environment | — | 2002-09-10 |
| 5887343 | Direct chip attachment method | Matthew M. Salatino, Mike Newton, Dale R. Setlak | 1999-03-30 |
| 5862248 | Integrated circuit device having an opening exposing the integrated circuit die and related methods | Matthew M. Salatino, Nicolaas W. VanVonno | 1999-01-19 |