Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6586832 | Semiconductor device and fabrication process thereof | Junji Oka, Yasumasa Kasuya | 2003-07-01 |
| 6537858 | Method for manufacturing semiconductor device | — | 2003-03-25 |
| 6462420 | Semiconductor chip and semiconductor device having a chip-on-chip structure | Junichi Hikita, Hiroo Mochida, Goro Nakatani | 2002-10-08 |
| 6461890 | Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the same | — | 2002-10-08 |
| 6458609 | Semiconductor device and method for manufacturing thereof | Junichi Hikita, Tsunemori Yamaguchi, Tadahiro Morifuji, Osamu Miyata | 2002-10-01 |
| 6448660 | Semiconductor device and production process thereof | — | 2002-09-10 |
| 6399419 | Production of semiconductor device | Shigeyuki Ueda | 2002-06-04 |
| 6391685 | Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devices | Junichi Hikita, Shigeyuki Ueda | 2002-05-21 |
| 6376915 | Semiconductor device and semiconductor chip | Junichi Hikita, Shigeyuki Ueda | 2002-04-23 |
| 6369407 | Semiconductor device | Junichi Hikita, Hiroo Mochida | 2002-04-09 |
| 6229199 | Packaged semiconductor device | — | 2001-05-08 |
| 6204564 | Semiconductor device and method for making the same | Osamu Miyata, Shigeyuki Ueda | 2001-03-20 |
| 6133637 | Semiconductor device having a plurality of semiconductor chips | Junichi Hikita, Tsunemori Yamaguchi, Tadahiro Morifuji, Osamu Miyata | 2000-10-17 |
| 6046506 | Semiconductor device with package | Junichi Hikita | 2000-04-04 |
| 6034437 | Semiconductor device having a matrix of bonding pads | — | 2000-03-07 |
| 5877937 | Encapsulated semiconductor device and electronic circuit board mounting same | Tomoharu Horio | 1999-03-02 |
| 5762744 | Method of producing a semiconductor device using an expand tape | Yutaka Murakami | 1998-06-09 |
| 5757082 | Semiconductor chips, devices incorporating same and method of making same | — | 1998-05-26 |
| 5750153 | Mold device and process for resin-packaging semiconductor devices | — | 1998-05-12 |
| 5723902 | Surface mounting type electronic component | Yasunobu Shoji | 1998-03-03 |
| 5666003 | Packaged semiconductor device incorporating heat sink plate | Sadahito Nishida | 1997-09-09 |
| 5521430 | Semiconductor apparatus and its manufacturing method | — | 1996-05-28 |
| 5471097 | Resin encapsulated semiconductor device with an electrically insulating support and distortion preventing member | — | 1995-11-28 |
| 5436198 | Method of manufacturing semiconductor device having straight wall bump | — | 1995-07-25 |
| 5411920 | Lead frame, semiconductor device, and method of manufacturing same | — | 1995-05-02 |