Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10857648 | Trapezoidal CMP groove pattern | John Nguyen, Tony Quan Tran, Jeffrey James Hendron | 2020-12-08 |
| 10857647 | High-rate CMP polishing method | John Nguyen, Tony Quan Tran, Jeffrey James Hendron | 2020-12-08 |
| 10861702 | Controlled residence CMP polishing method | John Nguyen, Tony Quan Tran, Jeffrey James Hendron | 2020-12-08 |
| 10777418 | Biased pulse CMP groove pattern | John Nguyen, Tony Quan Tran, Jeffrey James Hendron | 2020-09-15 |
| 10586708 | Uniform CMP polishing method | John Nguyen, Tony Quan Tran, Jeffrey James Hendron | 2020-03-10 |
| 9802293 | Method to shape the surface of chemical mechanical polishing pads | Jeffrey James Hendron | 2017-10-31 |
| 7234224 | Curved grooving of polishing pads | Steven Naugler, Steven J. Pufka, Weitung Wang | 2007-06-26 |