Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105649 | Semiconductor component and corresponding production method | — | 2015-08-11 |
| 8981513 | Electrical circuit and method for producing an electrical circuit | Mathias Bruendel, Daniel Pantel, Frederik Ante, Johannes Kenntner | 2015-03-17 |
| 8981499 | MEMS chip package and method for manufacturing an MEMS chip package | Mathias Bruendel, Andre Gerlach, Christina Leinenbach, Sonja Knies, Ando Feyh +1 more | 2015-03-17 |
| 8902604 | Component support and assembly having a MEMS component on such a component support | Jochen Zoellin, Ulrike Scholz | 2014-12-02 |
| 8836099 | Leadless package housing having a symmetrical construction with deformation compensation | — | 2014-09-16 |
| 8816453 | MEMS component and a semiconductor component in a common housing having at least one access opening | Jochen Zoellin, Ulrike Scholz | 2014-08-26 |
| 8816454 | Component having a micromechanical microphone pattern | Jochen Zoellin, Juergen Graf, Christoph Schelling, Frederik Ante, Michael Curcic | 2014-08-26 |
| 8659100 | MEMS component having a diaphragm structure | Jochen Zoellin, Ulrike Scholz | 2014-02-25 |
| 8631813 | Method for producing a microfluidic system | Mathias Bruendel, Frieder Haag, Jochen Rupp, Ulrike Scholz | 2014-01-21 |
| 8549743 | Method for hot embossing at least one conductive track onto a substrate | Johanna May | 2013-10-08 |